高性能封装（先进封装）首席集成技术专家

<p style="text-align:justify"> </p><p><span style="font-size:12.0px"><span style="font-family:Verdana, Geneva, sans-serif">与我们携手施展你的超能力！ </span></span></p><p> </p><p><span style="font-size:12.0px"><span style="font-family:Verdana, Geneva, sans-serif">探索未知、打破壁垒、勇于发现，你准备好了吗？你有宏图大志正待实现，我们同样雄心勃勃。我们遍布全球的员工热爱科技创新，以医药健康、生命科学和电子科技领域的解决方案，切实改善人类生活。我们怀揣远大梦想，热忱关爱员工、客户、患者和人类居住的这颗星球。因此我们一直在寻找永葆好奇心的你，与我们一路同行、敢想敢做，把不可能变为可能！</span></span></p><p><span style="font-size:12.0px"><span style="font-family:Verdana, Geneva, sans-serif"> </span></span></p><p><span style="font-size:12.0px"><span style="font-family:Verdana, Geneva, sans-serif">在电子科技，我们所做的一切都是为了成为众多企业推进数字化生活的幕后推手。我们致力于作为值得信赖的供应商，为电子、汽车和化妆品行业提供高科技材料、服务和特种化学品。我们培养了一个全球协作的组织，我们的员工热情好胜、秉持客户至上、充满好奇心且行动敏捷。我们齐心协力突破科学的极限，为客户创造更多可能。</span></span></p><p style="text-align:justify"> </p><br><p data-path-to-node="3">This role will define High-Performance Packaging opportunities, build ecosystem engagement strategies in China, and lead cross-functional programs connecting internal business units with local customers, OSATs, foundries, IDMs, equipment/materials suppliers, universities, research institutes, and industry platforms.</p><p data-path-to-node="4"><strong>Your Role </strong></p><ul data-path-to-node="5"><li><p data-path-to-node="5,0,0"><strong data-index-in-node="0" data-path-to-node="5,0,0">Identify Market & Tech Trends:</strong> Track advanced packaging technology inflection points and roadmaps in China—spanning WLP, Fan-Out, 2.5D/3D, Chiplets, HBM packaging, TSV, RDL, hybrid/fusion bonding, advanced substrates, CMP, cleaning, deposition, lithography, and metrology.</p></li><li><p data-path-to-node="5,1,0"><strong data-index-in-node="0" data-path-to-node="5,1,0">Map Ecosystem Landscape:</strong> Map the local semiconductor packaging ecosystem and continuously evaluate key players, technical capabilities, capital investments, localization needs, and strategic collaboration opportunities.</p></li><li><p data-path-to-node="5,2,0"><strong data-index-in-node="0" data-path-to-node="5,2,0">Drive Strategic Partnerships:</strong> Develop and execute engagement plans with Chinese customers, OSATs, foundries, IDMs, equipment/materials suppliers, universities, research institutes, and industry consortia.</p></li><li><p data-path-to-node="5,3,0"><strong data-index-in-node="0" data-path-to-node="5,3,0">Translate Insights to Execution:</strong> Convert ecosystem insights into actionable product requirements, application development priorities, partner strategies, and go-to-market (GTM) recommendations for internal teams.</p></li><li><p data-path-to-node="5,4,0"><strong data-index-in-node="0" data-path-to-node="5,4,0">Lead Technical Programs:</strong> Formulate Statement of Work (SOW), Proof of Concept (POC), Design of Experiments (DOE), and joint development proposals that align customer technical needs with the company’s material and process capabilities.</p></li></ul><p data-path-to-node="6"><strong data-index-in-node="0" data-path-to-node="6">Who You Are</strong></p><ul data-path-to-node="7"><li><p data-path-to-node="7,0,0"><strong data-index-in-node="0" data-path-to-node="7,0,0">Education:</strong> Master’s degree or higher in Materials Science, Microelectronics, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related engineering fields.</p></li><li><p data-path-to-node="7,1,0"><strong data-index-in-node="0" data-path-to-node="7,1,0">Domain Expertise:</strong> 10+ years of hands-on R&D experience in 300mm wafer processes, equipment, materials, or integration, with a strong preference for advanced packaging background.</p></li><li><p data-path-to-node="7,2,0"><strong data-index-in-node="0" data-path-to-node="7,2,0">Program Leadership:</strong> 5+ years of experience leading external collaborations, customer engagements, ecosystem programs, or driving SOW/POC/DOE execution.</p></li><li><p data-path-to-node="7,3,0"><strong data-index-in-node="0" data-path-to-node="7,3,0">Industry Network:</strong> Strong professional network and deep working knowledge of China’s advanced packaging landscape, including local customers, OSATs, foundries, IDMs, suppliers, and research platforms.</p></li></ul><p data-path-to-node="8"><strong data-index-in-node="0" data-path-to-node="8">Preferred Qualifications</strong></p><ul data-path-to-node="9"><li><p data-path-to-node="9,0,0">Experience partnering with advanced packaging consortia, innovation hubs, or key semiconductor industry clusters in China.</p></li><li><p data-path-to-node="9,1,0">Proven ability to navigate ambiguity, influence across matrixed global organizations, and translate complex technical topics into strategic business recommendations.</p></li><li><p data-path-to-node="9,2,0">Entrepreneurial mindset, high self-drive, and exceptional resource alignment capability to deliver business results.<br><br></p><p data-path-to-node="12">本职位将负责定义高性能封装的技术与业务机会，制定中国先进封装生态的合作策略；同时作为核心纽带，推动关键项目落地，全面打通公司内部业务单元与中国本土客户、封测厂、晶圆厂、IDM、设备及材料供应商、高校、科研机构及产业平台之间的协同合作。</p><p data-path-to-node="13"><strong data-index-in-node="0" data-path-to-node="13">主要职责</strong></p><ul data-path-to-node="14"><li><p data-path-to-node="14,0,0"><strong data-index-in-node="0" data-path-to-node="14,0,0">把握技术趋势与路线图：</strong> 精准识别中国先进封装领域的关键技术拐点与路线图，涵盖晶圆级封装（WLP）、扇出型封装（Fan-Out）、2.5D/3D、Chiplet、HBM相关封装、TSV、RDL、混合键合、熔融键合、先进基板、CMP、清洗、沉积、光刻及量测等技术方向。</p></li><li><p data-path-to-node="14,1,0"><strong data-index-in-node="0" data-path-to-node="14,1,0">梳理与评估生态图谱：</strong> 深入梳理中国先进封装生态系统，持续跟踪重点企业的技术能力、投资动态、国产化替代需求及战略合作契机。</p></li><li><p data-path-to-node="14,2,0"><strong data-index-in-node="0" data-path-to-node="14,2,0">制定并推进生态合作计划：</strong> 建立并执行针对中国客户、封测厂、晶圆厂、IDM、设备与材料厂商、高校、科研机构及产业联盟的深度合作计划。</p></li><li><p data-path-to-node="14,3,0"><strong data-index-in-node="0" data-path-to-node="14,3,0">洞察转化与内部赋能：</strong> 将外部生态洞察转化为内部产品需求、应用开发优先级、合作伙伴策略及市场进入（GTM）建议。</p></li><li><p data-path-to-node="14,4,0"><strong data-index-in-node="0" data-path-to-node="14,4,0">联合开发与技术落地：</strong> 负责制定 SOW（工作任务书）、POC（概念验证）、DOE（实验设计）及联合开发方案，将客户的技术痛点与公司的材料及工艺能力进行高效对接。</p></li></ul><p data-path-to-node="15"><strong data-index-in-node="0" data-path-to-node="15">基本要求</strong></p><ul data-path-to-node="16"><li><p data-path-to-node="16,0,0"><strong data-index-in-node="0" data-path-to-node="16,0,0">学历背景：</strong> 材料科学、微电子、化学工程、电子工程、机械工程或相关工程专业硕士及以上学历。</p></li><li><p data-path-to-node="16,1,0"><strong data-index-in-node="0" data-path-to-node="16,1,0">行业经验：</strong> 10 年以上 300mm 晶圆工艺、设备、材料或集成研发的实操经验，有先进封装领域研发背景者优先。</p></li><li><p data-path-to-node="16,2,0"><strong data-index-in-node="0" data-path-to-node="16,2,0">项目与合作经验：</strong> 5 年以上外部合作、客户对接、生态项目领导及 SOW/POC/DOE 制定与落地的实际经验。</p></li><li><p data-path-to-node="16,3,0"><strong data-index-in-node="0" data-path-to-node="16,3,0">行业资源：</strong> 深度熟悉中国先进封装产业链，在本土客户、封测厂、晶圆厂、IDM、设备/材料商及科研平台方面拥有深厚的行业资源与网络。</p></li></ul><p data-path-to-node="17"><strong data-index-in-node="0" data-path-to-node="17">优先条件</strong></p><ul data-path-to-node="18"><li><p data-path-to-node="18,0,0">具备先进封装产业联盟、创新平台或中国半导体产业集群的深度合作经验。</p></li><li><p data-path-to-node="18,1,0">具备极强的抗压与应变能力，能在高度不确定的环境中高效工作；具备跨矩阵组织的协同影响力，能将复杂的技术问题转化为可执行的商业策略。</p></li><li><p data-path-to-node="18,2,0">具备创业者思维与强烈的自驱力，善于整合各方资源并以结果为导向推动项目闭环。</p></li></ul><p data-path-to-node="9,2,0"><br><br></p></li></ul><br><p> </p><p><span style="font-size:12.0px"><span style="font-family:Verdana, Geneva, sans-serif"><strong>我们提供的机遇：</strong>我们是一群充满好奇心的伙伴，有着不同的背景、视角和生活经历。我们相信，多元化将推动卓越与创新，从而提升我们在科技领域的领导力。我们致力于为所有人创造平等的发展机会，让每个人都能按照自己的节奏成长。加入我们，共同打造一个具有包容性与归属感的文化，影响数百万人，助力每个人推动人类进步！</span></span></p><p> </p><p><span style="font-size:12.0px"><span style="font-family:Verdana, Geneva, sans-serif">立即申请，加入这个致力于点燃创新火花，提升人类福祉的团队！</span></span></p>